International Embedded Systems Symposium 2009 - Call for Papers
Over recent
years, embedded systems have gained an enormous amount of processing
power and functionality. Many of the formerly external components can
now be integrated into a single System-on-Chip. This tendency has
resulted in a dramatic reduction in the size and cost of embedded
systems. As a unique technology, the design of embedded systems is an
essential element of many innovations.
Embedded systems meet their performance goals, including real-time
constraints, through a combination of special-purpose hardware and
software components tailored to the system requirements. Both the
development of new features and the reuse of existing intellectual
property components are essential to keeping up with ever demanding
customer requirements. Furthermore, design complexities are steadily
growing with an increasing number of components that have to cooperate
properly. Embedded system designers have to cope with multiple goals
and constraints simultaneously, including timing, power, reliability,
dependability, maintenance, packaging and, last but not least, price.
The significance of these constraints varies depending on the
application area a system is targeted for. Typical embedded
applications include multi-media, automotive, medical, and
communication devices.
The goals of the International Embedded Systems Symposium are to
present exchange and discuss the state of the art, novel ideas, actual
research results, and future trends in the field of embedded systems.
Contributors and participants from both industry and academia are
encouraged to take active part in this symposium.
Topics: Topics include, but are not restricted to the following:
Submissions due | |
Notification of acceptance | |
Final papers |
Important Dates for Tutorial Submission:
A tutorial
submission should consist of a title and an abstract (0,5 to 1 page)
including names and affiliation.
Please send your tutorial proposal to: tutorial@iess.org
April
1, 2009 |
Submissions due |
May 2,
2009 |
Notification of acceptance |
The Proceedings will be published by Springer, the official publisher of IFIP. IMPORTANT: Springer changed the layout for the IFIP series. Full details on how to format your paper can be found at the web site of the conference publisher Springer. Springer will contact you if the paper is not in the proposed layout. Accepted full papers have a page limit of 12 pages, short papers of 8 pages. Again, please make sure to use the right paper style. Please submit all source files (LaTeX or Word only) of your paper including a PDF or PS file into one zip-archive and upload it using your paper ID and password to the submission system at latest July 8, 2009. Only zip-archive will be accepted by the system.
Please submit your final paper sources by using your paper ID and password to:
or in case of problems with the submission system by e-mail: iess@iess.org
General Chairs | Achim
Rettberg Carl v. Ossietzky University Oldenburg OFFIS Escherweg 2 D-26121 Oldenburg Germany Phone: +49 (441) 9722-247 Fax: +49 (441) 9722-282 Email: achim.rettberg@iess.org |
Mauro
C. Zanella ZF Friedrichshafen AG D-88038 Friedrichshafen Germany Phone: +49 (7541) 77-7963 Fax: +49 (7541) 77-907963 Email: mauro.zanella@zf.com |
General Co-Chair | Franz
J. Rammig University Paderborn Fuerstenallee 11 D-33094 Paderborn Germany Phone: +49 (5251) 60-6500 Fax: +49 (5251) 60-6502 Email: franz@upb.de |
|
Technical Program Chair | Michael
Amann ZF Friedrichshafen AG D-88038 Friedrichshafen Germany Phone: +49 (7541) 77-7357 Fax: +49 (7541) 77-907357 Email: m.amann@zf.com |
|
Local Arrangements Chair | Michael
Keckeisen ZF Friedrichshafen AG D-88038 Friedrichshafen Germany Phone: +49 (7541) 77-7090 Fax: +49 (7541) 77-907090 Email: michael.keckeisen@zf.com |
Samar
Abdi – University of California at Irvine, USA
Christian Allmann – Audi Electronics Venture, Germany
Michael Amann – ZF Friedrichshafen, Germany
Richard Anthony – The University of Greenwich, England
Jürgen
Becker – University Karlsruhe, Germany
Christophe Bobda – University of Potsdam, Germany
Florian Dittmann – TWT, Germany
Rainer Doemer – University of California at Irvine, USA
Cecilia Ekelin – Volvo Technology Corporation, Sweden
Rolf Ernst – Technical University Braunschweig, Germany
Masahiro Fujita – University of Tokyo, Japan
Andreas Gerstlauer – University of Texas Austin, USA
Marcelo Götz – UFRGS, Brazil
Joerg Henkel – University Karlsruhe, Germany
Uwe
Honekamp – Vector Informatik, Germany
Marcel Jackowski – USP, Brazil
Michael Keckeisen – ZF Friedrichshafen, Germany
Kane Kim
– University of California at Irvine, USA
Bernd Kleinjohann – C-LAB, Germany
Hermann Kopetz – Technical University Vienna, Austria
Horst Krimmel – ZF Friedrichshafen, Germany
Jean-Claude Laprie – LAAS, France
Thomas Lehmann – HAW Hamburg, Germany
Armin Lichtblau – Mentor Graphics, Germany
Patrick Lysaght – Xilinx Research Labs, USA
Roger May – Altera, England
Wolfgang Nebel – Carl von Ossietzky University Oldenburg, Germany
Mike Olivarez – Freescale Semiconductor, USA
Frank Oppenheimer – OFFIS, Germany
Carlos Pereira – UFRGS, Brazil
Franz Rammig – University Paderborn, Germany
Achim Rettberg – Carl von Ossietzky University Oldenburg, Germany
Carsten Rust – Sagem Orga, Germany
Stefan Schimpf – ETAS, Germanyl
Juergen Schirmer – Robert Bosch GmbH, Stuttgart, Germany
Gunar Schirner – University of California at Irvine, USA
Aviral Shrivastava – Arizona State University, USA
Joachim
Stroop – dSPACE, Germany
Hiroyuki Tomiyama – Nagoya University, Japan
Ansgar Traechtler – University Paderborn, Germany
Flavio R. Wagner – UFRGS, Brazil
Wayne Wolf – Georgia Institute of Technology, USA
Mauro Zanella – ZF Friedrichshafen, Germany
Jianwen Zhu – University of Toronto, Canada
Advanced symposium registration must be made not later than August 20, 2009
Location and Travel Information:
The conference will be held near Friedrichshafen (Germany) at Schloß Montfort, Langenargen, September 14. - 16. 2009.
For detailed travel information click here.
Check if you need a VISA for Germany. If you need an invitation letter for your VISA please contact us.
Interested in sponsoring this event?
Please contact: sponsoring@iess.org |
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Interested in IESS?
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Copyright: webmaster@iess.org. Last update: 27. July 2009