International Embedded Systems Symposium 2009 - Call for Papers

Conference Theme:

Over recent years, embedded systems have gained an enormous amount of processing power and functionality. Many of the formerly external components can now be integrated into a single System-on-Chip. This tendency has resulted in a dramatic reduction in the size and cost of embedded systems. As a unique technology, the design of embedded systems is an essential element of many innovations.
Embedded systems meet their performance goals, including real-time constraints, through a combination of special-purpose hardware and software components tailored to the system requirements. Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever demanding customer requirements. Furthermore, design complexities are steadily growing with an increasing number of components that have to cooperate properly. Embedded system designers have to cope with multiple goals and constraints simultaneously, including timing, power, reliability, dependability, maintenance, packaging and, last but not least, price. The significance of these constraints varies depending on the application area a system is targeted for. Typical embedded applications include multi-media, automotive, medical, and communication devices.

The goals of the International Embedded Systems Symposium are to present exchange and discuss the state of the art, novel ideas, actual research results, and future trends in the field of embedded systems. Contributors and participants from both industry and academia are encouraged to take active part in this symposium.

Topics: Topics include, but are not restricted to the following:

Important Dates:

April 5, 2009 April 25, 2009
Submissions due
May 8, 2009 June 22, 2009
Notification of acceptance
May 30, 2009 July 8, 2009
Final papers

Important Dates for Tutorial Submission:

A tutorial submission should consist of a title and an abstract (0,5 to 1 page) including names and affiliation.
Please send your tutorial proposal to:

April 1, 2009
Submissions due
May 2, 2009
Notification of acceptance

Final Paper Submission:

The Proceedings will be published by Springer, the official publisher of IFIP. IMPORTANT: Springer changed the layout for the IFIP series. Full details on how to format your paper can be found at the web site of the conference publisher Springer. Springer will contact you if the paper is not in the proposed layout. Accepted full papers have a page limit of 12 pages, short papers of 8 pages. Again, please make sure to use the right paper style. Please submit all source files (LaTeX or Word only) of your paper including a PDF or PS file into one zip-archive and upload it using your paper ID and password to the submission system at latest July 8, 2009. Only zip-archive will be accepted by the system.

  • Download the Copyright form and fax to Achim Rettberg, Fax: +49 (441) 9722-282.
  • Please submit your final paper sources by using your paper ID and password to:

    Organizing Committee:

    General Chairs Achim Rettberg
    Carl v. Ossietzky University Oldenburg
    Escherweg 2
    D-26121 Oldenburg
    Phone: +49 (441) 9722-247
    Fax: +49 (441) 9722-282
    Mauro C. Zanella
    ZF Friedrichshafen AG
    D-88038 Friedrichshafen
    Phone: +49 (7541) 77-7963
    Fax: +49 (7541) 77-907963

    General Co-Chair Franz J. Rammig
    University Paderborn
    Fuerstenallee 11
    D-33094 Paderborn
    Phone: +49 (5251) 60-6500
    Fax: +49 (5251) 60-6502
    Technical Program Chair Michael Amann
    ZF Friedrichshafen AG
    D-88038 Friedrichshafen
    Phone: +49 (7541) 77-7357
    Fax: +49 (7541) 77-907357
    Local Arrangements Chair Michael Keckeisen
    ZF Friedrichshafen AG
    D-88038 Friedrichshafen
    Phone: +49 (7541) 77-7090
    Fax: +49 (7541) 77-907090

    Tentative Program Committee:

    Samar Abdi – University of California at Irvine, USA
    Christian Allmann – Audi Electronics Venture, Germany
    Michael Amann – ZF Friedrichshafen, Germany
    Richard Anthony – The University of Greenwich, England
    ürgen Becker  – University Karlsruhe, Germany
    Christophe Bobda – University of Potsdam, Germany
    Florian Dittmann – TWT, Germany
    Rainer Doemer – University of California at Irvine, USA
    Cecilia Ekelin – Volvo Technology Corporation, Sweden
    Rolf Ernst – Technical University Braunschweig, Germany
    Masahiro Fujita – University of Tokyo, Japan
    Andreas Gerstlauer – University of Texas Austin, USA
    Marcelo Götz – UFRGS, Brazil
    Joerg Henkel – University Karlsruhe, Germany
    Uwe Honekamp – Vector Informatik, Germany
    Marcel Jackowski – USP, Brazil
    Michael Keckeisen – ZF Friedrichshafen, Germany
    Kane Kim – University of California at Irvine, USA
    Bernd Kleinjohann – C-LAB, Germany
    Hermann Kopetz – Technical University Vienna, Austria
    Horst Krimmel – ZF Friedrichshafen, Germany
    Jean-Claude Laprie – LAAS, France
    Thomas Lehmann – HAW Hamburg, Germany
    Armin Lichtblau – Mentor Graphics, Germany
    Patrick Lysaght – Xilinx Research Labs, USA
    Roger May – Altera, England
    Wolfgang Nebel – Carl von Ossietzky University Oldenburg, Germany
    Mike Olivarez – Freescale Semiconductor, USA
    Frank Oppenheimer – OFFIS, Germany
    Carlos Pereira – UFRGS, Brazil
    Franz Rammig – University Paderborn, Germany
    Achim Rettberg – Carl von Ossietzky University Oldenburg, Germany
    Carsten Rust – Sagem Orga, Germany
    Stefan Schimpf – ETAS, Germanyl
    Juergen Schirmer – Robert Bosch GmbH, Stuttgart, Germany
    Gunar Schirner – University of California at Irvine, USA
    Aviral Shrivastava – Arizona State University, USA
    Joachim Stroop – dSPACE, Germany
    Hiroyuki Tomiyama – Nagoya University, Japan
    Ansgar Traechtler – University Paderborn, Germany
    Flavio R. Wagner – UFRGS, Brazil
    Wayne Wolf – Georgia Institute of Technology, USA
    Mauro Zanella – ZF Friedrichshafen, Germany
    Jianwen Zhu – University of Toronto, Canada


    Advanced symposium registration must be made not later than August 20, 2009

    You can pay by bank transfer to:
    Please use the reference information for the bank transfer!

    Location and Travel Information: 

    The conference will be held near Friedrichshafen (Germany) at Schloß Montfort, Langenargen, September 14. - 16. 2009.

    For detailed travel information click here.

    Check if you need a VISA for Germany. If you need an invitation letter for your VISA please contact us.


    WG 10.2 and 10.5

    ZF Friedrichshafen AG

    Carl von Ossietzky
    University Oldenburg

    University of Paderborn

    Interested in sponsoring this event?

    Please contact:

    OFFIS e.V.

    EBV Elektronik GmbH & Co. KG

    Altera Corporation

    Interested in IESS?

    Please contact:

    Copyright: Last update: 27. July 2009