IESS

Program Committee (Tentative):


Samar Abdi – Concordia University Montreal, Canada
Christian Allmann – Audi Electronics Venture, Germany
Michael Amann – ZF Friedrichshafen, Germany
Richard Anthony – The University of Greenwich, England
Jürgen Becker – University Karlsruhe, Germany
Alecio Binotto – IBM Research, Brazil
Christophe Bobda – University of Arkansas, USA
Luigi Carro – Federal University of Rio Grande do Sul, Brazil
Florian Dittmann – Kromberg & Schubert GmbH & Co. KG, Germany
Rainer Doemer – University of California at Irvine, USA
Cecilia Ekelin – Volvo Technology Corporation, Sweden
Rolf Ernst – Technical University Braunschweig, Germany
Danubia B. Espindola – Federal University of Rio Grande, Brazil
Mohammad Al Faruque – University of California at Irvine, USA
Masahiro Fujita – University of Tokyo, Japan
Andreas Gerstlauer – University of Texas Austin, USA
Tayfun Gezgin – Lufthansa Cargo, Germany
Marcelo Götz – Federal University of Rio Grande do Sul, Brazil
Kim Grüttner – OFFIS, Germany
Andreas Hein – Carl von Ossietzky University Oldenburg, Germany
Joerg Henkel – University Karlsruhe, Germany
Stefan Henkler – University of Applied Science Dortmund, Germany
Carsten Homburg – dSPACE, Germany
Uwe Honekamp – Vector Informatik, Germany
Michael Huebner – Ruhr-University Bochum, Germany
Marcel Jackowski – University of Sao Paulo, Brazil
Ricardo Jacobi – University of Brasilia, Brazil
Michael Keckeisen – ZF Friedrichshafen, Germany
Timo Kerstan – Vector Informatik, Germany
Amin Khajeh – Intel, USA
Doo-Hyun Kim – Konkuk University, Korea
Hermann Kopetz – Technical University Vienna, Austria
Marcio Kreutz – Federal University of Rio Grande do Norte, Brazil
Horst Krimmel – ZF Friedrichshafen, Germany
Thomas Lehmann – HAW Hamburg, Germany
Armin Lichtblau – Mentor Graphics, Germany
Patrick Lysaght – Xilinx Research Labs, USA
Roger May – Altera, England
Adam Morawiec – ECSI, France
Wolfgang Nebel – Carl von Ossietzky University Oldenburg, Germany
Markus Oertel – Vector Informatik, Germany
Mike Olivarez – Freescale Semiconductor, USA
Carlos Pereira – Federal University of Rio Grande do Sul, Brazil
Edison Pignaton de Freitas – Federal University of Rio Grande do Sul, Brazil
Franz Rammig – University Paderborn, Germany
Achim Rettberg – Hella Electronics & Carl von Ossietzky University Oldenburg, Germany
Stefan Schimpf – ETAS, Germany
Juergen Schirmer – Robert Bosch GmbH, Stuttgart, Germany
Gunar Schirner – Northeastern University Boston, USA
Aviral Shrivastava – Arizona State University, USA
Joachim Stroop – dSPACE, Germany
Hamed Tabkhi – Northeastern University Boston, USA
Hiroyuki Tomiyama – Ritsumeikan University, Japan
Flavio R. Wagner – Federal University of Rio Grande do Sul, Brazil
Marco Wehrmeister – Federal University of Technology Parana, Brazil
Marilyn Wolf – Georgia Institute of Technology, USA
Mauro Zanella – ZF Friedrichshafen, Germany
Jianwen Zhu – University of Toronto, Canada